Qualcomm announced the Snapdragon X2 Plus at CES 2026, targeting Windows on Arm laptops for professionals and creators with superior efficiency. Built on a 3nm process, it features up to a 10-core third-gen Qualcomm Oryon CPU and 80 TOPS NPU for on-device AI.
Core Performance Specs
The top 10-core variant (X2P-64-100) includes 6 Prime cores at 4.0GHz and 4 Performance cores at up to 3.4GHz, with 34MB total cache, delivering 35% faster single-core speed than Snapdragon X Plus while using 43% less power. A 6-core option (X2P-42-100) offers 22MB cache at the same peak frequency. It supports up to 128GB LPDDR5X-9523 RAM and an upgraded Adreno GPU.
AI and Battery Breakthroughs
The Hexagon NPU hits 80 TOPS, enabling over 50 local AI tasks like editing and multimodal generation without cloud reliance. Qualcomm promises multi-day battery life with no performance drop on battery, powered by intelligent management. Connectivity includes optional 5G (X75 modem), Wi-Fi 7, and Bluetooth 5.4.
Enterprise Security Edge
Snapdragon Guardian provides hardware-rooted protection via Qualcomm SPU with Microsoft Pluton, plus features like presence detection, biometrics, and out-of-band remote management. Laptops from major OEMs arrive in H1 2026.
Official Promo Highlights
Images from Qualcomm showcase the Snapdragon X2 Plus branding with performance claims and a comparison table versus prior chips.
Detailed Specs Table
A leaked specs sheet outlines CPU configs, NPU at 80 TOPS, and features like multi-day battery.
